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Substrate Base Package

The substrate can provide power connection, protection, support, heat dissipation, assembly and other functions for the chip to achieve multi pin, reduce the volume of packaged products, improve electrical performance and heat dissipation, ultra-high density or multi chip modularization.
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Wafer Level Package

Provide differentiated 2.5D/3D integrated solutions in wafer level packaging, flip chip interconnection and other fields
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Leadframe Base Package

Support multiple advanced SiP technologies such as double-sided shaping, EMI electromagnetic shielding, laser assisted bonding, etc
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Memory Package

In flip chip packaging, silicon chips are directly fixed on the substrate with solder bumps rather than wires, providing dense interconnects with high electrical and thermal performance.
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Test Capacity

MEMS and sensors can be widely used in many systems in the communication, consumer, medical, industrial and automotive markets.
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Substrate Base Package

Wafer Level Package

Leadframe Base Package

Memory Package

Test Capacity

ABOUT US

Chinese integrated circuit (IC) encapsulation test service provider

Tongfu Microelectronics (security code: 002156) as a Chinese integrated circuit (IC) encapsulation test service provider provides one-stop design simulation and encapsulation test services for global customers. Tongfu Microelectronics engages in products, technologies and services in many fields, including network communication, mobile terminals, household appliances, AI, auto electronics, etc.

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  • 1997

    Year

    Found

  • 7

    Production Bases

  • 7000

    +

    Technical Management Team

TFME

APPLICATION FIELD

Artificial Intelligence

One stop service, including design simulation, wafer in-process testing, packaging, finished product testing, system level testing, etc. A wide range of products are widely used in consumer, industrial and automotive products, including high-performance computing, big data storage, network communications, mobile terminals, vehicle electronics, artificial intelligence, the Internet of Things, industrial intelligence and other fields.

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Network Communication

One stop service, including design simulation, wafer in-process testing, packaging, finished product testing, system level testing, etc. A wide range of products are widely used in consumer, industrial and automotive products, including high-performance computing, big data storage, network communications, mobile terminals, vehicle electronics, artificial intelligence, the Internet of Things, industrial intelligence and other fields.

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Big Data Storage

One stop service, including design simulation, wafer in-process testing, packaging, finished product testing, system level testing, etc. A wide range of products are widely used in consumer, industrial and automotive products, including high-performance computing, big data storage, network communications, mobile terminals, vehicle electronics, artificial intelligence, the Internet of Things, industrial intelligence and other fields.

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On Board Electronics

One stop service, including design simulation, wafer in-process testing, packaging, finished product testing, system level testing, etc. A wide range of products are widely used in consumer, industrial and automotive products, including high-performance computing, big data storage, network communications, mobile terminals, vehicle electronics, artificial intelligence, the Internet of Things, industrial intelligence and other fields.

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Internet of Things

One stop service, including design simulation, wafer in-process testing, packaging, finished product testing, system level testing, etc. A wide range of products are widely used in consumer, industrial and automotive products, including high-performance computing, big data storage, network communications, mobile terminals, vehicle electronics, artificial intelligence, the Internet of Things, industrial intelligence and other fields.

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TFME

Tongfu Microelectronics Co., Ltd. 

Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China

Post code: 226004

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