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Learning from Examples of Suzhou Merchants 2022--Visit to Tongfu Microelectronics Was Held in the Company
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09/28/2022

Learning from Examples of Suzhou Merchants 2022--Visit to Tongfu Microelectronics Was Held in the Company

In the afternoon on September 27, Learning from Examples of Suzhou Merchants 2022--Visit to Tongfu Microelectronics: Visit to and Exchange with Private Enterprises jointly organized by the Industry

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2022 rankings of Jiangsu Top 100 Private Enterprises were released, Tongfu Microelectronics won many honorary titles
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09/28/2022

2022 rankings of Jiangsu Top 100 Private Enterprises were released, Tongfu Microelectronics won many honorary titles

In the afternoon on September 23, 2022 Jiangsu top 100 private enterprise conference organized by Jiangsu Provincial Federation of Industry and Commerce was held in Nanjing City. On the conference, several titles were released, including “2022 Jiangsu Top 200 Private Enterprise”, “

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TFME

Substrate Base Package

The substrate can provide power connection, protection, support, heat dissipation, assembly and other functions for the chip to achieve multi pin, reduce the volume of packaged products, improve electrical performance and heat dissipation, ultra-high density or multi chip modularization.
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TFME

Wafer Level Package

Provide differentiated 2.5D/3D integrated solutions in wafer level packaging, flip chip interconnection and other fields
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Leadframe Base Package

Support multiple advanced SiP technologies such as double-sided shaping, EMI electromagnetic shielding, laser assisted bonding, etc
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Memory Package

In flip chip packaging, silicon chips are directly fixed on the substrate with solder bumps rather than wires, providing dense interconnects with high electrical and thermal performance.
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Test Capacity

MEMS and sensors can be widely used in many systems in the communication, consumer, medical, industrial and automotive markets.
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Substrate Base Package

TFME

Substrate Base Package

Wafer Level Package

TFME

Wafer Level Package

Leadframe Base Package

TFME

Leadframe Base Package

Memory Package

TFME

Memory Package

Test Capacity

TFME

Test Capacity

ABOUT US

Chinese integrated circuit (IC) encapsulation test service provider

Tongfu Microelectronics (security code: 002156) as a Chinese integrated circuit (IC) encapsulation test service provider provides one-stop design simulation and encapsulation test services for global customers. Tongfu Microelectronics engages in products, technologies and services in many fields, including network communication, mobile terminals, household appliances, AI, auto electronics, etc.

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  • 1997

    Year

    Found

  • 7

    Production Bases

  • 7000

    +

    Technical Management Team

TFME

APPLICATION FIELD

Artificial Intelligence

Artificial Intelligence

One stop service, including design simulation, wafer in-process testing, packaging, finished product testing, system level testing, etc. A wide range of products are widely used in consumer, industrial and automotive products, including high-performance computing, big data storage, network communications, mobile terminals, vehicle electronics, artificial intelligence, the Internet of Things, industrial intelligence and other fields.

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Network Communication

Network Communication

One stop service, including design simulation, wafer in-process testing, packaging, finished product testing, system level testing, etc. A wide range of products are widely used in consumer, industrial and automotive products, including high-performance computing, big data storage, network communications, mobile terminals, vehicle electronics, artificial intelligence, the Internet of Things, industrial intelligence and other fields.

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Big Data Storage

Big Data Storage

One stop service, including design simulation, wafer in-process testing, packaging, finished product testing, system level testing, etc. A wide range of products are widely used in consumer, industrial and automotive products, including high-performance computing, big data storage, network communications, mobile terminals, vehicle electronics, artificial intelligence, the Internet of Things, industrial intelligence and other fields.

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On Board Electronics

On Board Electronics

One stop service, including design simulation, wafer in-process testing, packaging, finished product testing, system level testing, etc. A wide range of products are widely used in consumer, industrial and automotive products, including high-performance computing, big data storage, network communications, mobile terminals, vehicle electronics, artificial intelligence, the Internet of Things, industrial intelligence and other fields.

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Internet of Things

Internet of Things

One stop service, including design simulation, wafer in-process testing, packaging, finished product testing, system level testing, etc. A wide range of products are widely used in consumer, industrial and automotive products, including high-performance computing, big data storage, network communications, mobile terminals, vehicle electronics, artificial intelligence, the Internet of Things, industrial intelligence and other fields.

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TFME

Tongfu Microelectronics Co., Ltd. 

Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China

Post code: 226004

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