导航
搜索
Quality
Current Location:
Homepage
/
Environment Announcements
/
Periodic Acceptance Examination of IC Encapsulation Test Industry Base of Phase I Project of Hefei Tongfu

Quality

All categories

Periodic Acceptance Examination of IC Encapsulation Test Industry Base of Phase I Project of Hefei Tongfu

(Summary description)Periodic Acceptance Examination of IC Encapsulation Test Industry Base of Phase I Project of Hefei Tongfu

Periodic Acceptance Examination of IC Encapsulation Test Industry Base of Phase I Project of Hefei Tongfu

(Summary description)Periodic Acceptance Examination of IC Encapsulation Test Industry Base of Phase I Project of Hefei Tongfu

Information

 

Scan the QR code to read on your phone

Previous: Reply to Environment Impact Assessment Report Form of IC Encapsulation Test Phase II Engineering of Nantong Tongfu Microelectronics Co., Ltd.
Next: Renewal of 2017 Sewage Discharge License of Tongfu Microelectronics
Previous: Reply to Environment Impact Assessment Report Form of IC Encapsulation Test Phase II Engineering of Nantong Tongfu Microelectronics Co., Ltd.
Next: Renewal of 2017 Sewage Discharge License of Tongfu Microelectronics

  • 合肥通富 一期项目集成电路封测产业基地阶段性验收.pdf

    Size:
    2022-02-24 17:35:04
    Download
    Download
Previous page
1
TFME

Tongfu Microelectronics Co., Ltd. 

Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China

Post code: 226004

Copyright © 2023 Tongfu Microelectronics Co., Ltd.  苏ICP备05003519号