导航
搜索
Quality
Current Location:
Homepage
/
Environment Announcements
/
Reply to Environment Impact Assessment Report Form of IC Encapsulation Test Phase II Engineering of Nantong Tongfu Microelectronics Co., Ltd.

Quality

All categories

Reply to Environment Impact Assessment Report Form of IC Encapsulation Test Phase II Engineering of Nantong Tongfu Microelectronics Co., Ltd.

(Summary description)Reply to Environment Impact Assessment Report Form of IC Encapsulation Test Phase II Engineering of Nantong Tongfu Microelectronics Co., Ltd.

Reply to Environment Impact Assessment Report Form of IC Encapsulation Test Phase II Engineering of Nantong Tongfu Microelectronics Co., Ltd.

(Summary description)Reply to Environment Impact Assessment Report Form of IC Encapsulation Test Phase II Engineering of Nantong Tongfu Microelectronics Co., Ltd.

Information

 

Scan the QR code to read on your phone

Previous: Environment Impact Assessment Reply to Xiamen Tongfu Phase I IC Encapsulation Test Industry Base
Next: Periodic Acceptance Examination of IC Encapsulation Test Industry Base of Phase I Project of Hefei Tongfu
Previous: Environment Impact Assessment Reply to Xiamen Tongfu Phase I IC Encapsulation Test Industry Base
Next: Periodic Acceptance Examination of IC Encapsulation Test Industry Base of Phase I Project of Hefei Tongfu

  • 《南通通富微电子有限公司集成电路封装测试二期工程环境影响报告表》批复.pdf

    Size:
    2022-02-24 17:35:19
    Download
    Download
Previous page
1
TFME

Tongfu Microelectronics Co., Ltd. 

Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China

Post code: 226004

Copyright © 2023 Tongfu Microelectronics Co., Ltd.  苏ICP备05003519号