Background requirements:
1. Bachelor degree or above, major in electronics, machinery, chemistry and other science and engineering
2. Experience in Flipchip process of semiconductor packaging is preferred
3. Proficient in Flipchip related full-process packaging process, and have practical research experience in equipment and materials in multiple processes
More than 8 years of Flipchip packaging experience, 6sigma certification is preferred
4. Age 30-40, working in Nantong
Key skills and responsibilities:
1. Develop and optimize new packaging processes related to Flip chip according to customer requirements
2. Communicate internally and externally, coordinate and solve technical, material, equipment and other problems, and be able to formulate relevant short-term and short-term solutions
3. Be able to do experimental design DOE, complete data collection and report in detail
4. Good communication, coordination and organization skills