Background information:
1. Bachelor degree or above, major in electronics, machinery, chemistry and other science and engineering
2. Experience in Flipchip process of semiconductor packaging is preferred
3. More than 5 years of experience as process engineer and more than 3 years of project management experience, PMI certification is preferred
4. Age 30-40, working in Nantong
Key skills and responsibilities:
1. Proficient in Flipchip related full-process packaging process, and have practical research experience in equipment and materials in multiple processes
2. Be able to skillfully use project management skills to promote the efficient progress of the project. Communicate with customers and manage the whole process of the project, and coordinate to solve relevant technical problems
3. For new project import, complete data collection and detailed report can be conducted
4. Good communication, coordination and organization skills