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Encapsulation material ICP report

Product ICP report

Encapsulation Materials ICP Report

HDS-C194-241210

935.5KB

Fusheng-C7025-240902

815.5KB

Fusheng-EFTEC64T-240201

504.2KB

Fusheng-A194-240902

1.1MB

HDS-C7025 UPG RT-231202

517.5KB

HDS-Ag plating-241209

964.3KB

HDS-C7025-Ag-240902

443.1KB

HENGHUI-Ag Plating-240423

757.9KB

HENGHUI-A194FH-240423

765.3KB

Huayang-C194+Ag-240929

646.6KB

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Tongfu Microelectronics

Tongfu Micro

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Tongfu Microelectronics Co., Ltd.

Tongfu Microelectronics

Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China

Postal code: 226004

Email: sales.enquiry@tfme.com

通富微 No. 32060202001174