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Encapsulation material ICP report

Product ICP report

Encapsulation Materials ICP Report

MHT-C7025 Ag(JP)-250124

949.1KB

Kangqiang-NiPdAu plating-240614

429.0KB

Flux-TACFLUX 026S-240329

699.9KB

Resonac-4900GC-Halogen-241224

625.4KB

Resonac-4900GCN3-240701

274.1KB

Heesung-HS-RF-240708-2

246.0KB

Heesung-HS-GPF-240709-2

242.7KB

Heesung-HS-ES5-240708-2

240.9KB

Doublink-HCP2-240510

442.4KB

Hysol huawei-GR 360A(ON), GR 360A, GR 360A-ST-240712

1.4MB

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Tongfu Microelectronics

Tongfu Micro

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Tongfu Microelectronics Co., Ltd.

Tongfu Microelectronics

Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China

Postal code: 226004

Email: sales.enquiry@tfme.com

通富微 No. 32060202001174