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Encapsulation material ICP report

Product ICP report

LeadFrame

HDS-Ag plating-241209

964.3KB

HDS-C7025-Ag-240902

443.1KB

HENGHUI-Ag Plating-240423

757.9KB

HENGHUI-A194FH-240423

765.3KB

Huayang-C194+Ag-240929

646.6KB

Huayang-Ag-240929

621.4KB

LD-KFC(C19210)-240514

913.1KB

Huayang-C7025-240929

652.3KB

LD-C194(XYK-4)-241101

841.9KB

Kangqiang-EFTEC-64T-240614

462.8KB

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Tongfu Microelectronics

Tongfu Micro

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Tongfu Microelectronics Co., Ltd.

Tongfu Microelectronics

Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China

Postal code: 226004

Email: sales.enquiry@tfme.com

通富微 No. 32060202001174