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Encapsulation material ICP report

Product ICP report

Solder

Heraeus-PbSn2Ag2.5-241203

623.0KB

Heraeus-PbSn5Ag2.5-241203

650.5KB

Heraeus-PbSn5Ag2.5-D3-RM218-8-RoHS-241207

603.8KB

Heraeus-SnAg25Sb10-241203

615.7KB

Heraeus-PbSn10Ag2-241203

655.9KB

Heraeus-PbSn10-241203

681.3KB

Nanda-PbSn2Ag2.5-250224

710.5KB

Nanda-Sn90Sb10-240412

1.1MB

Nanda-SnAg25Sb10-250224

651.3KB

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Tongfu Microelectronics

Tongfu Micro

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Tongfu Microelectronics Co., Ltd.

Tongfu Microelectronics

Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China

Postal code: 226004

Email: sales.enquiry@tfme.com

通富微 No. 32060202001174