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RoHS Inquiry

Encapsulation material ICP report

Product ICP report

Solder Ball

Senju-M705-240509

754.5KB

Senju-SAC405-240319

713.1KB

Accurus-SAC266-241204

420.1KB

Accurus-SAC305-240916

411.8KB

Accurus-SACN125005-240916

407.9KB

Duksan-Sn1.2Ag0.5Cu0.05Ni-RoHS2-250121

3.0MB

Duksan-Sn1.2Ag0.5Cu0.05Ni-RoHS1-250121

2.3MB

Accurus-SAC405-240916

407.2KB

Duksan-Sn3.0Ag0.5Cu0.05Ni-RoHS1-250121

2.2MB

Duksan-Sn3.0Ag0.5Cu0.05Ni-RoHS2-250121

2.8MB

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Tongfu Microelectronics

Tongfu Micro

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Tongfu Microelectronics Co., Ltd.

Tongfu Microelectronics

Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China

Postal code: 226004

Email: sales.enquiry@tfme.com

通富微 No. 32060202001174