2020
Release date:
2020-04-21
April 21, 2020 First wafer produced for the gold bump process
2020-4-21
First wafer with gold bumps produced
Attachment
Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
