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Tongfu Microelectronics Wins Texas Instruments' Best Outstanding Supplier Award

Release date:

2022-04-20

Recently, Tongfu Microelectronics Co., Ltd. (hereinafter referred to as "TFME") was honored with the 2021 Texas Instruments Award for its outstanding performance in areas such as cost control, environmental and social responsibility, technology, rapid response, and high-quality delivery.

　　Recently, Tongfu Microelectronics Co., Ltd. (hereinafter referred to as "TFME") was honored with the 2021 Texas Instruments (hereinafter referred to as "TI") Outstanding Supplier Award, thanks to its exceptional performance in areas such as cost control, environmental and social responsibility, technology, rapid response, and high-quality delivery. This marks TFME's second consecutive win of TI's Best Outstanding Packaging and Testing Supplier Award since the outbreak of the pandemic in 2020.
　　Every day, more than 12,000 suppliers worldwide provide services to TI. Being recognized with the TI Outstanding Supplier Award represents TI’s highest endorsement of TFME’s excellence in areas such as cost control, technology, responsiveness, supply chain management, quality assurance, and on-time delivery.
　　TFME CEO Mr. Shi Lei emphasized:
　　“As a testing and packaging service provider with 7 production facilities, TFME boasts an extensive portfolio of packaging solutions—ranging from traditional wire-bonding packages to flip-chip, wafer-level high-density advanced packaging, as well as fan-out Wafer Level and 2.5D, SiP technologies. We provide professional manufacturing services to customers worldwide and have earned widespread recognition within the industry. It is truly an honor for us to receive TI’s Best Outstanding Supplier Award. We deeply value TI’s partnership and appreciate the dedicated efforts of both teams. Moving forward, TFME will relentlessly pursue innovation, enhance productivity, and deliver consistently high-quality services and products, ensuring stable, premium support for our global clients.”

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