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The topping-out ceremony for Phase III of Tongfu Microelectronics Co., Ltd. in the Suzhou-Suzhou-Tongzhou Industrial Park was successfully held.

Release date:

2022-12-02

On November 30, the topping-out ceremony for the third-phase project of Nantong Tongfu Microelectronics Co., Ltd. was held at Tongfu Microelectronics Park in the Su-Xi-Tong Industrial Zone. Attendees included Yu Yuesong, Secretary of the Park's Party and Trade Union Committee; Huang Xiaofeng, Deputy Secretary of the Party Committee and Director of the Management Committee; Mao Zhibin, Member of the Party Committee and Deputy Director of the Management Committee; Shi Mingda, Chairman of Tongfu Microelectronics; and Shi Lei, President of Tongfu Microelectronics.

　　On November 30, the topping-out ceremony for the third-phase project of Nantong Tongfu Microelectronics Co., Ltd. was held at Tongfu Micro's factory area in the Su-Xi-Tong Industrial Park. Attendees included Yu Yuesong, Secretary of the Park's Party and Trade Union Committee; Huang Xiaofeng, Deputy Secretary of the Committee and Director of the Management Committee; Mao Zhibin, Member of the Committee and Deputy Director of the Management Committee; Shi Mingda, Chairman of Tongfu Microelectronics; and Shi Lei, President of Tongfu Microelectronics.

　　In his speech, Tongfu Microelectronics President Shi Lei stated that the simultaneous commencement of construction on the third-phase project—spanning over 100,000 square meters—is a rare milestone in the development history of Tongfu Microelectronics Group, presenting us with significant challenges. Particularly since the beginning of this year, our city has experienced frequent outbreaks, leading to unprecedented difficulties and obstacles during the project's construction. However, thanks to the strong support and assistance from the Party Working Committee, Management Committee, and various relevant departments of the Suzhou-Xishan-Tongzhou Industrial Park, we were able to ensure the timely and successful capping of the third-phase project, successfully completing this critical stage of construction. On behalf of the company, Shi Lei extended heartfelt gratitude and sincere respect to the park authorities and all the project builders!

　　In his speech, Huang Xiaofeng, Deputy Secretary of the Party Working Committee and Director of the Management Committee of the park, stated that today marks the official topping-out ceremony for Tongfu Microelectronics' Phase III project—a milestone that significantly enhances the development of the park's "two leading, one emerging" flagship industries, injecting fresh vitality and momentum into the park's high-quality growth. The park will continue to uphold its philosophy of being business-friendly, business-secure, and business-enriching, offering enterprises efficient, convenient, and attentive "one-stop" services. Furthermore, we will steadily strengthen our "Wanshi Hao Tong · Shuxin Ban" service brand, providing robust support in areas such as policy incentives, infrastructure support, and talent recruitment—ensuring businesses have the strongest possible foundation to thrive and expand within the park.

　　The Phase III project of Tongfu Microelectronics is located on the south side of Wudangshan Road and the north side of Jiangshan Road in the Su-Xi-Tong Industrial Park, with a total investment of 964 million yuan. The project will employ cutting-edge technologies and innovative processes—such as integrated circuit packaging and testing—that are backed by independent intellectual property rights. Once completed, it will establish an annual production capacity of 280 million units of next-generation communication IC products, including those for 5G applications. This milestone underscores Tongfu Microelectronics' accelerated expansion into the national market and its ambition to set a new industry benchmark in the IC packaging and testing sector, propelling the company toward its goal of becoming a world-class IC packaging and testing enterprise—and ultimately contributing to the park's high-quality development.

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