Investor
Report by the Sponsor and Joint Lead Underwriters on the Compliance of Tongfu Microelectronics Co., Ltd.'s Non-Public Offering Process and Subscription Participants
Release date:
2022-11-02
Report by the Sponsor and Joint Lead Underwriters on the Compliance of the Non-Public Offering Process and Subscription Participants of Tongfu Microelectronics Co., Ltd.
Report by the Sponsor and Joint Lead Underwriters on the Compliance of the Non-Public Offering Process and Subscription Participants of Tongfu Microelectronics Co., Ltd.
Attachment
Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
