The union holds its fourth Guan Dan tournament.
Release date:
2023-08-03
On July 22, the Tongfu Microelectronics Union and the Guan Dan Association jointly hosted the 4th Guan Dan Tournament. Employees from 11 departments—including the Administrative Center, Quality Center, Business Center, as well as teams from A1/A3, D2, the Wafer Division, and the Surface Treatment Center—participated in the competition, with a total of 48 players taking part.
The competition will be held in a round-robin format with no eliminations. After four rounds of competition, Ji Mingrong and Qu Hongliang from the Surface Treatment Center earned the highest scores to claim first place, while She Lian and Jiang Shan from the A3 Assembly Department took second place, and Tao Ximing and Zhu Xiwen from the same department finished third.
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Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
