News

Home page

Tongfu Microelectronics Wins "2023 NXP Best Innovation Partner Award"

Release date:

2024-05-16

From May 13 to 14, Glenn Daves, Senior Vice President of Package Innovation at NXP (referred to as NXP hereafter), along with Veer Dhandapani, Vice President of Package Innovation, and Kelly Folts, Senior Director of Package Innovation, led a 16-member NXP team to Tongfu Microelectronics for the 13th Technical Forum exchange meeting.

Tongfu Microelectronics Wins "2023 NXP Best Innovation Partner Award"

From May 13 to 14, Glenn Daves, Senior Vice President of Package Innovation at NXP (hereafter referred to as NXP), along with Veer Dhandapani, Vice President of Package Innovation, and Kelly Folts, Senior Director of Package Innovation, led a 16-member NXP team to visit Tongfu Microelectronics. Together, they held the 13th Technical Forum Exchange Meeting and presented Tongfu Microelectronics with two significant awards: the "2023 NXP Best Technology Innovation Partner Award" and the "First Place in the First Half of 2024 Technical Seminar." Stone Lei, Chairman and President of Tongfu Microelectronics, Xia Xin, Executive Vice President and COO of Tongfu Microelectronics, and representatives from their respective teams also attended the event.

During the event, NXP and TFME The two sides engaged in an in-depth technical exchange and expressed their intention to further strengthen their collaborative partnership in the future, continuously exploring new opportunities for business development, striving to achieve even greater results, and moving forward hand in hand to create a brighter future together. 。