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Tongfu Microelectronics' Suzhou-Xitong Factory Phase II Begins Mass Production

Release date:

2020-08-10

The Tongfu Microelectronics Intelligent Chip Packaging and Testing Project, located in the Su-Xi-Tong Industrial Park, is a major provincial-level industrial project. On the morning of August 9, the project's Phase II officially began mass production, with an expected annual sales revenue of 600 million yuan once fully operational. Wang Kai, Secretary of the Party Working Committee of the Su-Xi-Tong Industrial Park, and Yu Yuesong, Deputy Secretary of the Party Working Committee and Director of the park, attended the launch ceremony.

　　The Tongfu Microelectronics Intelligent Chip Packaging and Testing Project is planned with a total investment of 8 billion yuan, to be implemented in three phases. Among them, the second-phase project broke ground on July 1, 2018, and will introduce the world's most advanced FC-based high-end packaging product line. These products are expected to find extensive applications in emerging infrastructure sectors such as consumer electronics, the Internet of Things, connected vehicles, and 5G networks. Once fully operational, the facility will feature 240 sets of high-end equipment and employ 600 workers, with an anticipated monthly production capacity of 60 million integrated circuits. This is projected to generate annual sales revenue of 600 million yuan.

　　As the world's fifth-largest and China's second-largest integrated circuit packaging and testing company, Tongfu Microelectronics continued to achieve double-digit growth in sales revenue last year. This year, the company’s production and business goals include surpassing 10 billion yuan in sales revenue, with the Suzhou-Xishan-Tongzhou factory aiming for year-on-year growth of more than 80% in sales revenue.

For details, please click the link: https://www.ntjoy.com/html/tuijian/2020/0809/213172.shtml

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