The 2024 Tongfu Microelectronics Industry Chain Collaborative High-Quality Development Conference was grandly held.

  6 On the 18th of the month, the 2024 Tongfu Microelectronics Industry Chain Collaborative High-Quality Development Conference was grandly held at the InterContinental Hotel in Nantong Binjiang. Attendees included Huang Xiaofeng, Deputy Secretary of the Party Working Committee and Director of the Management Committee of the Suzhou-Xishan-Tongzhou Science and Technology Industrial Park; Ding Zhixiang, Deputy Secretary of the Party Working Committee and Director of the Management Committee of Nantong North High-tech Zone; Gu Wei, Member of the Party Working Committee of the Suzhou-Xishan-Tongzhou Science and Technology Industrial Park; Xu Jingchang, Member of the Party Working Committee and Deputy Director of the Management Committee of Nantong North High-tech Zone; Shi Lei, Chairman and President of Tongfu Microelectronics; Shi Mingda, Honorary Chairman and Vice Chairman of Tongfu Microelectronics; Xia Xin, Executive Vice President and Chief Operating Officer of Tongfu Microelectronics; along with more than 500 guests, including customer representatives, supplier representatives, and financial industry leaders from around the globe.

  This conference is themed around Under the theme "Joining Hands for High-Quality Development and Jointly Building New-Generation Productivity," we will carry forward our cultural heritage of "people-oriented, industry-driven national development, cultural inheritance, and pursuit of excellence," while upholding our core values of "integrity, customer focus, commitment, and innovation." We are committed to forging Tongfu's supply chain along the Belt and Road Initiative, establishing the Tongfu Industry Alliance, fostering a comprehensive Tongfu ecosystem, and driving forward Tongfu's high-quality development in all aspects.

At the conference, Chairman Shi Lei delivered a keynote report titled "Joining Hands for High-Quality Development and Jointly Building New-Generation Productivity." In his report, the Chairman discussed the macroeconomic outlook for 2024, trends in the semiconductor industry, the guiding principles from the General Secretary's important speeches, Tongfu's practical implementation of new-generation productivity, and expressed gratitude toward Honorary Chairman Shi Mingda. He also outlined Tongfu's philosophy, path, and advantages in pursuing high-quality development, highlighted the company's collaborative supply-chain relationships, and shared plans to establish the Tongfu Industry Alliance. Through these efforts, Tongfu aims to accelerate the development of cutting-edge productivity, deepen high-level partnerships, and collectively advance China's unique approach to modernization—embarking on a new chapter of innovation and growth while actively contributing to the creation of a beautiful, sustainable global future.

At the meeting, Xia Xin, Executive Vice President and Chief Operating Officer of the company, delivered a sharing report covering topics such as establishing new operational mechanisms, driving group resource integration, implementing the "Iron Triangle" model, strengthening quality management, comprehensively advancing cost reduction initiatives, diligently building core competitive advantages, and optimizing supplier relationship management.

At the meeting, Huang Xiaofeng, Deputy Secretary of the Party Working Committee and Director of the Management Committee of Nantong-Suzhou-Tongxiang Science and Technology Industrial Park, presented an overview of the park; meanwhile, Ding Zhixiang, Deputy Secretary of the Party Working Committee and Director of the Management Committee of Nantong North High-tech Zone, introduced the Nantong North High-tech Zone.

At the sub-venue framework, specialized reports and seminars were held on topics including substrate packaging, wafer/advanced packaging, and intelligent manufacturing. Gao Xiong, Deputy General Manager of the HVP product line; Zhao Yajun, General Manager of the HPC product line; Ji Hongbin, General Manager of the MMY product line; Li Hairong, General Manager of the FC/SiP product line; and Yu Zheng, General Manager of the WLP product line, each delivered detailed product-line presentations. Du Maohua, Director of Corporate Strategic Planning, also presented a comprehensive report, while Shi Feng, Director of the Information Technology and Intelligent Management Center, shared insights during the intelligent manufacturing seminar. Additionally, customer representatives from Naxinwei, Beiling, ZTE Microelectronics, Shenzhen Feixiang, MediaTek, Shanghai Aivi Electronics, along with specially invited supplier representatives, joined the discussion to explore how upstream and downstream players in the industry can collaborate effectively to achieve high-quality development in this new stage of growth.

The conference awarded 28 prizes across four categories—Best Supplier, Outstanding Plant Contractor, Excellent Supplier, Project Construction Collaboration Award, Comprehensive Strategic Partnership Award, Top Supplier, Best Quality Award, and Emergency Support Award—to recognize 135 suppliers. Li Dingzhuan, Chairman of Lidin Semiconductor Technology (Shenzhen) Co., Ltd., delivered a speech as the supplier representative.

At the gala dinner held to thank attendees, Tongfu Microelectronics Honorary Chairman and Vice Chairman Shi Mingda delivered a warm and enthusiastic toast. The Honorary Chairman expressed profound respect and heartfelt gratitude to entrepreneurs and business friends from the industry chain and supply chain for their generous support and invaluable assistance to Tongfu Microelectronics, as well as appreciation to financial partners for their unwavering backing and help.

Together, let's pursue high-quality development and jointly build new-generation productivity. Tongfu Microelectronics is committed to advancing hand-in-hand with every capable and ambitious partner in the industry chain, fostering collaborative innovation, igniting momentum and vitality across the entire value chain, and ultimately creating a unified, industry-wide community of shared destiny. In this new era, let’s cultivate fresh opportunities, pioneer innovative pathways, achieve mutual value creation, and enjoy prosperity together!