Advanced Packaging Technology Upgrade and Capacity Expansion for High-Bandwidth Storage Chiplets: Full Public Disclosure of Environmental Impact Assessment Report and Dedicated Risk Assessment
Release date:
2024-09-09
Advanced Packaging Technology Upgrade and Capacity Expansion Environmental Impact Report, along with the Full Public Disclosure of Risk Assessment for High-Bandwidth Storage Chiplet.
Advanced packaging technology upgrade and capacity expansion for high-bandwidth storage chiplets
Environmental Impact Assessment Report and Comprehensive Public Disclosure of the Risk Special Section
I. Basic Project Information
Serial Number | Construction Project Name | Construction Entity | Construction Site |
1 | Advanced packaging technology upgrade and capacity expansion for high-bandwidth storage chiplets | Nantong Tongfu Microelectronics Co., Ltd. | Sudong Science and Technology Industrial Park, Jiangda Road, Nantong City 99 Number |
II. Contact Information for Public Participation
Contact for the construction unit: Wang Yinzhu
Contact number: 18962807358
Environmental Impact Assessment Unit Contact: Engineer Lin
Contact number: 025-87783362
Email: linzhenyu@yuanhenghj.com
Link: https://pan.baidu.com/s/1hNiP4C3dfkIbIFjgI5wBKQ
Passcode: rmix
Attachment
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File size: 30.0KB
Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
