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Unveiling a New Chapter—The Tongfutongda Advanced Packaging and Testing Base Project Breaks Ground Today

Release date:

2024-09-20

On the morning of September 20, 2024, the groundbreaking ceremony for the Tongfu Tongda Advanced Packaging and Testing Base Project was held with great enthusiasm at the Tongda Plot in the North High-tech Zone of Nantong City. Zhang Tong, Deputy Secretary of the Nantong Municipal Party Committee and Mayor; Ling Yi, Vice Mayor of the Municipal Government; Hu Yongjun, Secretary of the Chongchuan District Party Committee; Yang Wanping, Deputy Secretary and District Mayor of Chongchuan District; Yan Chongming, Director of the Standing Committee of the Chongchuan District People's Congress; Jiang Jianchun, Chairman of the Chongchuan District CPPCC; and Xu Haiyan, Deputy Secretary of the Chongchuan District Party Committee and Secretary of the Party Working Committee of the North High-tech Zone, among other leaders, attended the event in person. Additionally, representatives from Nantong Customs and banking partners were also present, joining hands with representatives from Tongfu Microelectronics to lay the foundation stone for the groundbreaking of the Tongfu Tongda Advanced Packaging and Testing Base Project.

This event was chaired by District Chief Yang Wanping. Attendees included Shilei, Chairman and President of Tongfu Microelectronics; Mingda Shi, Honorary Chairman and Vice Chairman; Xinxia, Executive Vice President and COO; as well as representatives from relevant departments within the company.

At the ceremony, Secretary Hu Yongjun extended warm congratulations on the project's groundbreaking. In his speech, he emphasized that the Tongfu Tongda Project represents Tongfu Microelectronics' bold move into new frontiers and emerging opportunities. It is also a vital component of the province-level, 10-billion-yuan flagship project—the Tongfu Advanced Packaging and Testing Base—and a pivotal step for Tongfu Microelectronics as it embarks on its journey toward achieving a market capitalization and production value of 100 billion yuan. Secretary Hu expressed his hope that Tongfu Microelectronics will seize this project launch as a fresh starting point, set even higher goals, attract top talent, and ultimately become a global industry leader. At the same time, he urged the construction team to make the most of this golden period, ensuring safety, implementing scientific scheduling, and meticulously organizing every aspect of the project—so that it can be completed, put into operation, and deliver tangible results ahead of schedule.

In his speech, Chairman and President Shi Lei mentioned that upon completion, the Tongfu Tongda Advanced Packaging and Testing Base project will primarily focus on application areas such as communications, memory, and computing power. The project will place particular emphasis on integrated circuit packaging products that are nationally encouraged and supported, including multi-layer stacking, flip-chip, wafer-level, and panel-level packaging technologies. Since its establishment nearly 30 years ago, Tongfu Microelectronics has steadfastly upheld the belief of contributing to the nation through industry, boldly taking the lead in tackling cutting-edge technological challenges in the packaging and testing field. By closely addressing the critical bottlenecks hindering the advancement of advanced IC packaging and testing, the company has provided robust support to ensure the autonomy, security, and controllability of both the industrial and supply chains.

Today's groundbreaking ceremony marks a key milestone as Tongfu Microelectronics embarks on a new chapter in its industrial expansion within Nantong City's North High-Tech Zone, signaling the official transition of the project into its substantive construction phase.