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The equipment-in-place ceremony for the first piece of machinery in the second phase of the Memory project at Tongfu Tongke (Nantong) Microelectronics Co., Ltd. was successfully held.

Release date:

2024-09-20

On the morning of September 20, 2024, the equipment-in-place ceremony for the first piece of machinery marking the commencement of Phase II of the Memory project was held at Tongfu Tongke (Nantong) Microelectronics Co., Ltd. Attendees included Ling Yi, Vice Mayor of Nantong Municipal Government; Yang Wanping, Deputy Secretary of the Chongchuan District Committee and District Mayor; and Xu Haiyan, Deputy Secretary of the Chongchuan District Committee and Secretary of the Party Working Committee of the North City High-Tech Zone, among other leaders. Also present were representatives from Nantong Customs, banking partners, as well as Stone Lei, Chairman and President of Tongfu Microelectronics; Stone Mingda, Honorary Chairman and Vice Chairman; Xia Xin, Executive Vice President and Chief Operating Officer; and representatives from relevant departments within the company.

The equipment installation ceremony was hosted by Xia Xin, Executive Vice President and Chief Operating Officer of Tongfu Microelectronics. During the event, Chairman and President Shi Lei extended heartfelt gratitude to all guests from various sectors who have shown concern and support for the project's construction, actively contributing to its progress. Shi Lei emphasized that the smooth advancement of Tongfu Tongke Memory Phase II project not only benefits from the successful operation of Phase I but also reflects the collective efforts and dedication of everyone involved. The arrival of the first piece of equipment marks a significant milestone in Tongfu Microelectronics' ongoing development of its memory packaging and testing base in the North District High-Tech Zone, positioning the company at the forefront of memory packaging and testing technology while ensuring robust production capacity to meet the ever-growing demands of the market—and ultimately injecting powerful momentum into China's integrated circuit industry.

Ji Hongbin, General Manager of Tongfu Tongke (Nantong) Microelectronics Co., Ltd., shared an update on the project progress. The second phase of the Memory project has added an 8,000-square-meter cleanroom facility, which, once operational, will enable the company to produce 150,000 wafers per month overall. In addition, an additional 160 million yuan has been invested in new equipment—primarily critical machinery required for mass production of advanced products such as embedded FCCSP and uPOP technologies. These investments will better support the domestic demand for high-end memory solutions in key sectors like smartphones, solid-state drives, and servers.

The equipment-inauguration ceremony for the first piece of equipment in TONGFU MICROELECTRONICS' Phase II Memory Project marks a pivotal milestone in the company's development journey. Building on this as a fresh starting point, TONGFU MICROELECTRONICS will continue to relentlessly pursue excellence in advanced packaging and testing technologies, contributing significantly to Nantong's industrial transformation and upgrading, as well as to the robust growth of China's semiconductor industry.