Nantong Tongfu Microelectronics Co., Ltd. Advanced Packaging Technology R&D and Production Line Construction Project for High-Bandwidth Memory Chiplets: General Analysis of Environmental Impacts
Release date:
2025-01-24
Notice of General Environmental Impact Assessment for the Advanced Packaging Technology R&D and Production Line Project of High-Bandwidth Storage Chiplets at Nantong Tongfu Microelectronics Co., Ltd.
Notice of General Environmental Impact Assessment for the R&D and Production Line Construction Project of Advanced Packaging Technology for High-Bandwidth Memory Chiplets at Nantong Tongfu Microelectronics Co., Ltd.
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File size: 2.1MB
Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
