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The Tongfu Microelectronics Automotive Intelligent Packaging and Testing Center Project Successfully Tops Out

Release date:

2020-04-01

　　On March 31, the second day of the Investment Promotion Conference and Private Sector Development Conference held in Chongchuan District, the main structure of the Intelligent Packaging and Testing Center for Automotive Components, a project undertaken by Tongfu Microelectronics Co., Ltd.—the company honored as one of Chongchuan District's Top 10 Private Enterprises—was successfully topped out. Attending the event were Liu Hao, Member of the Municipal Party Committee and Secretary of the District Party Committee; Qian Suomei, Deputy Secretary of the District Party Committee and District Mayor; Tan Zhen, Member of the District Party Committee, Executive Deputy District Mayor, and Secretary of the Party Working Committee of the Development Zone; Zhang Yifeng, Deputy District Mayor; Ma Libing, Deputy Secretary of the Party Working Committee and Director of the Management Committee of the Development Zone; as well as Shi Mingda, Chairman of Tongfu Microelectronics, and Shi Lei, President of the company.

　　In his speech, Secretary Liu Hao warmly congratulated the successful topping-out of the project on behalf of the District Committee and the District Government. He emphasized that the completion of Tongfu Microelectronics' Intelligent Packaging and Testing Center for Automotive Components is not only a pragmatic move to align with national strategic initiatives and boost industrial development in Chongchuan, but also a powerful testament to the strong partnership and collaborative progress between government and enterprises.

　　In his speech, President Shi Lei stated that the Intelligent Packaging and Testing Center for Automotive Components is a flagship and pivotal project for Tongfu Group as it aligns with the trends of the times, accelerates its growth momentum, and strives to "build a world-class packaging and testing enterprise." It also stands as a major initiative in Jiangsu Province and Nantong City. The successful capping of the center marks a significant milestone in the project's construction, signaling a crucial step forward. Tongfu Microelectronics' progress has been made possible thanks to Chongchuan District's exceptional investment-friendly environment, supported wholeheartedly by the district committee, district government, and relevant departments. Looking ahead, he emphasized that both the company and the construction team will work closely together, adhering to the project timeline, to deliver a world-class green benchmark facility for integrated circuit packaging and testing—characterized by cutting-edge technology, state-of-the-art automation, superior environmental standards, and industry-leading energy efficiency. The goal is to ensure the facility is completed on schedule and fully operational, ultimately establishing Tongfu Microelectronics as a global leader in sustainable, eco-friendly IC packaging and testing solutions.

　　The ceremony was hosted by Xia Xin, Chief Operating Officer of Tongfu Microelectronics.

　　For details, please click the link. https://mp.weixin.qq.com/s/pyUZV0TG1MqxqmdUNcaMTw