On the morning of December 23, Xiamen Tongfu Microelectronics Co., Ltd. held a grand ceremony marking the official unveiling of the company and the trial production launch of its Phase I project. Tongfu Microelectronics Chairman Shi Mingda, President Shi Lei, along with leaders and guests including Lin Wensheng, Member of the Standing Committee of the Xiamen Municipal Party Committee and Secretary of the Haicang District Party Committee, and Li Huiyue, Vice Mayor of Xiamen City, jointly cut the ribbon to unveil Xiamen Tongfu.
On the morning of December 23, Xiamen Tongfu Microelectronics Co., Ltd. held a grand ceremony marking the company's official unveiling and the trial production launch of its Phase I project. Shi Mingda, Chairman of Tongfu Microelectronics, and Shi Lei, President of the company, joined Lin Wensheng, Member of the Standing Committee of Xiamen Municipal Party Committee and Secretary of Haicang District Party Committee, along with Li Huiyue, Vice Mayor of Xiamen, and other distinguished guests and leaders, to jointly cut the ribbon and unveil the new facility in Xiamen.
Tongfu Microelectronics President Shi Lei delivered a speech at the ceremony. He first expressed gratitude to the leaders of Xiamen City and its districts for their care and support in the construction of Tongfu Xiamen, and extended his condolences to the design firms, construction teams, supervision units, and colleagues at Tongfu Xiamen who have contributed to this project.
He pointed out that the construction of Tongfu's new factory in Xiamen represents a significant and critical step for Tongfu Microelectronics, as the company seizes the opportunity to actively respond to both industry policy trends and the growing domestic demand for integrated circuits—driven by applications such as 5G and IoT—while leveraging its industrialization base project to build a world-class, cutting-edge packaging and testing enterprise.
He emphasized the need to meticulously prepare for all aspects of the trial production launch, maintaining momentum and continuing efforts with renewed vigor, so as to swiftly achieve the targeted production scale and profitability. The goal is to establish Xiamen Tongfu as a world-class benchmark factory for wafer-level packaging—boasting the most comprehensive process technologies, the highest technical standards, and the most advanced automation capabilities—while also setting new industry-leading benchmarks in environmental protection and energy efficiency. Furthermore, he urged intensifying investment and innovation even more vigorously, accelerating the pace of Xiamen Tongfu's construction, and making indispensable contributions to the development of China's integrated circuit industry as well as to the economic and social progress of Xiamen and Haicang!
