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The feasibility review meeting for the construction plan of Jiangsu Province's Key Laboratory for Advanced Packaging and Testing of Integrated Circuits, along with the inaugural meeting of its Academic Committee, was successfully held.

Release date:

2019-12-02

On November 30, 2019, the feasibility review meeting for the construction plan of the "Jiangsu Provincial Key Laboratory for Advanced Packaging and Testing of Integrated Circuits," along with its inaugural Academic Committee meeting, was successfully held at Tongfu Microelectronics Co., Ltd. The laboratory was officially approved by the Jiangsu Provincial Department of Science and Technology and the Jiangsu Provincial Department of Finance, with Tongfu Microelectronics serving as the primary implementing entity, and Nantong University and Nanjing University of Posts and Telecommunications joining as co-builders. Representatives from the Jiangsu Provincial Department of Science and Technology, the Nantong Municipal Science and Technology Bureau, the Chongchuan District Science and Technology Bureau, the Academic Committee, and senior leaders from Tongfu Microelectronics attended the event.

The meeting announced the establishment of the First Academic Committee for Jiangsu Province’s Key Laboratory of Advanced Packaging and Testing for Integrated Circuits. Members of the Academic Committee come from Fudan University, Huajin Semiconductor Packaging Leading Technology R&D Center Co., Ltd., Tsinghua University, Southeast University, Nanjing University of Posts and Telecommunications, Nantong University, the National RFID System Engineering Technology Research Center, and Tongfu Microelectronics Co., Ltd. Professor Wei Zhang from Fudan University and Liqiang Cao, General Manager of Huajin Semiconductor, have been appointed as the Chairperson and Vice-Chairperson of the Academic Committee, respectively. This distinguished lineup of academic experts will provide robust support for the provincial key laboratory in areas such as strategic planning, research direction, technological innovation, and talent recruitment and development.

The Director of the Key Laboratory and President of Tongfu Microelectronics Co., Ltd., Shi Lei, delivered a welcoming speech, expressing sincere gratitude to the attending experts and leaders for joining us. He also warmly hoped that these esteemed experts would help the laboratory refine its overarching design and effectively implement its strategic plan.

The attending leaders and experts agreed that the project is accurately positioned with clear objectives, has assembled a high-caliber team of professionals, boasts robust management systems and operational mechanisms, features a well-designed overall framework, and presents a practical and feasible construction plan. They concluded that the project fully meets the basic requirements for establishing a key enterprise laboratory in Jiangsu Province, and unanimously approved the construction plan for the Jiangsu Provincial Advanced Packaging and Testing Key Laboratory for Integrated Circuits. At the same time, they recommended that the laboratory further strengthen industry-academia-research collaboration, launch open research projects aligned with its core areas of study, and actively pursue projects at or above the provincial and ministerial levels—particularly those tied to national and provincial industry development strategies—thereby driving technological advancements across the sector.