The company's product technology has won the National Integrated Circuit Packaging and Testing Alliance Innovation Technology Award.
Release date:
2019-11-25
On November 22, the National Integrated Circuit Packaging and Testing Industry Chain Technology Innovation Strategic Alliance held the "Advanced Integrated Circuit Packaging Industry Chain Collaborative Innovation Forum" at Xinhu in Wuxi, celebrating the alliance's tenth anniversary.
On November 22, the National Integrated Circuit Packaging and Testing Industry Chain Technology Innovation Strategic Alliance held the "Advanced Integrated Circuit Packaging Industry Chain Collaborative Innovation Forum" at Xinhu in Wuxi, celebrating the 10th anniversary of the alliance's establishment.
At the meeting, the decision on recognizing technological innovations in the integrated circuit packaging and testing industry chain was announced. Tongfu Microelectronics' independently developed "12-inch 28nm Advanced Packaging Full-Process Technology" was awarded the Technology Innovation Award, and Tongfu Microelectronics President Shi Lei received the Individual Outstanding Contribution Award.
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Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
