Tongfu Microelectronics awarded the Excellent Prize of the 2019 China Patent Award
Release date:
2019-10-14
On October 12, the results of the 21st China Patent Award were announced, and Tongfu Microelectronics' invention patent "ZL201010532337.9—Semiconductor Molding Package and Layered Scanning Method" received an Excellence Award.
On October 12, the results of the 21st China Patent Award were announced, and Tongfu Microelectronics' invention patent "ZL201010532337.9 Semiconductor Molding Body and Layered Scanning Method" received the Excellence Award.
The China Patent Award is jointly hosted by the National Intellectual Property Administration and the World Intellectual Property Organization, aiming to encourage and recognize patent holders and inventors (designers) who have made outstanding contributions to technological (design) innovation and socio-economic development. The award results are determined through a comprehensive evaluation conducted by a panel of renowned experts from various industries. This selection stands as one of the most authoritative patent rankings in China, serving as a key indicator for gauging the trends in China's technological innovation landscape.
For many years, Tongfu Microelectronics has consistently upheld technological innovation, earning the Excellent Award of the China Patent Award for two consecutive years in 2018 and 2019.
Please click the link for details: http://www.cnipa.gov.cn/docs/20191012081812888236.pdf
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Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
