Xiamen Tongfu Microelectronics Co., Ltd.'s Phase I main factory building successfully topped out.
Release date:
2018-12-17
On the morning of December 14, the main factory building for Phase I of Xiamen Tongfu Microelectronics Co., Ltd., a major industrial project in Fujian Province, was successfully topped out.
On the morning of December 14, the main factory building for Phase I of Xiamen Tongfu Microelectronics Co., Ltd., a major industrial project in Fujian Province, was successfully topped out. Zhang Shanmei, Deputy Director of the Hancang Taiwan-Invested Enterprise Management Committee in Xiamen; Shi Mingda, Chairman of Tongfu Microelectronics; Shi Lei, President of Tongfu Microelectronics; as well as representatives from the construction and supervision teams, attended the topping-out ceremony.
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Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
