Tongfu Microelectronics Makes a Spectacular Appearance at IC-China 2018
Release date:
2018-12-11
On December 11, the inaugural Global IC Entrepreneurs Conference and the 16th China Semiconductor Expo (IC-China 2018) were held at the Shanghai New International Expo Center.
On December 11, the inaugural Global IC Entrepreneurs Conference and the 16th China Semiconductor Expo (IC-China 2018) were held at the Shanghai New International Expo Center. Tongfu Microelectronics showcased its latest advanced packaging products and technological achievements, delivering a standout presence at this year's event. In the morning, Luo Wen, Vice Minister of China's Ministry of Industry and Information Technology, visited the company's booth. During the visit, Shi Mingda, Chairman of the company, and Shi Lei, President, provided an overview of the company's development progress and highlighted its innovative technological breakthroughs.
Recommended News
Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
