News

Home page

The 16th China Semiconductor Packaging and Testing Technology & Market Annual Conference Held in Hefei

Release date:

2018-11-24

From November 20 to 22, the 16th China Semiconductor Packaging and Testing Technology & Market Annual Conference 2018 was grandly held in Hefei, Anhui Province. Centered around the theme "Integrated Innovation, Intelligent Manufacturing, and Jointly Building the Integrated Circuit Packaging and Testing Industry Chain," the conference provided an invaluable platform for industry professionals to learn, exchange ideas, engage in in-depth discussions, and collaboratively explore opportunities for growth and development.

From November 20 to 22, the highly anticipated "16th China Semiconductor Packaging and Testing Technology & Market Annual Conference 2018" was grandly held in Hefei, Anhui Province. Centered around the theme "Integrated Innovation, Smart Manufacturing, and Jointly Building the Integrated Circuit Packaging and Testing Industry Chain," the conference provided an invaluable platform for industry professionals to learn, exchange ideas, engage in in-depth discussions, and collaboratively explore opportunities for growth and development.

At the opening ceremony held on the 20th, Shi Mingda, Chairman of Tongfu Microelectronics and also the current chairman of the Packaging Branch of the China Semiconductor Industry Association, delivered a warm welcome and heartfelt gratitude on behalf of the conference organizing committee and Tongfu Microelectronics to the distinguished guests and industry peers in attendance. During the event, Chairman Shi Mingda presented a report titled "Current Status and Prospects of China's Semiconductor Packaging Industry." Meanwhile, Shi Lei, President of Tongfu Microelectronics, delivered a keynote speech titled "The Packaging and Testing Industry Enters a New Era."

This year's annual conference has attracted a star-studded lineup of guests, marking an unprecedented grand event.

Shi Mingda, the current Chairman of the Packaging Branch of the China Semiconductor Industry Association and Chairman of Tongfu Microelectronics, delivers a welcome speech.

Lu Yunfeng, Member of the Standing Committee and Executive Deputy Mayor of Hefei, delivers a welcome speech.

Gong Chenghe, Executive Deputy Secretary-General of the China Semiconductor Industry Association, delivers a speech.

Shi Mingda, the current Chairman of the Packaging Branch of the China Semiconductor Industry Association and Chairman of Tongfu Microelectronics, delivered a report titled "Current Status and Prospects of China's Semiconductor Packaging and Testing Industry."

Mr. Ding Wenwu, President of the National Integrated Circuit Industry Development Fund Company, delivered a speech titled "Transformation and Opportunities in the Integrated Circuit Industry."

Ye Tianchun, Chief Technical Advisor of the National Key Science and Technology Project "02" and Director of the Institute of Microelectronics at the Chinese Academy of Sciences, delivers a speech.

Liu Wen, Deputy Director of the Hefei Development and Reform Commission, introduced the development status of Hefei's integrated circuit industry.

Xiang Xiang, Vice President of Shanghai HuaHong Group, delivered a keynote speech titled "Openness, Innovation, and Collaboration."

Shi Lei, President of Tongfu Microelectronics and Chairman of Hefei Tongfu Microelectronics Co., Ltd., delivered a keynote speech titled "The Integrated Circuit Packaging and Testing Industry Enters a New Era."

Return to list →