Chairman Shi Mingda attends the Xiamen Integrated Circuit Industry Development Symposium
Release date:
2018-10-18
On October 17, Shi Mingda, Chairman of Tongfu Microelectronics, was invited to attend the Xiamen (Haicang) Integrated Circuit Industry Development Symposium, where he engaged in a candid discussion on the path forward for the integrated circuit industry with Chen Xiangdong, Chairman of Hangzhou Silan; Wang Xinchao, Chairman of Changdian Technology; and Xiao Shengli, Chairman of Huatian Technology.
On October 17, Tongfu Microelectronics Chairman Shi Mingda was invited to attend the Xiamen (Haicang) Integrated Circuit Industry Development Symposium, where he engaged in a candid discussion on the path forward for the IC industry with Chen Xiangdong, Chairman of Hangzhou Silan; Wang Xinchao, Chairman of Changdian Technology; and Xiao Shengli, Chairman of Huatian Technology. Prior to the meeting, Chairman Shi Mingda personally inspected the progress of the Xiamen Tongfu project construction site.
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Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
