The company attends the 5th China International Semiconductor High-Level Summit
Release date:
2018-09-18
From September 18 to 20, the 5th Summit for Senior Executives in the Global Semiconductor Manufacturing Industry, the largest event of its kind, was held at the Kempinski Hotel Pudong in Shanghai. Mr. Li Yicong, Advisor to the Summit and COO of Tongfu Microelectronics, attended the opening ceremony and officially unveiled the golden lion sculpture.
From September 18 to 20, the 5th Summit for Senior Executives in the Global Semiconductor Manufacturing Industry, the largest event of its kind, was held at the Kempinski Hotel Pudong in Shanghai. Mr. Li Yicong, Advisor to the Summit and COO of Tongfu Microelectronics, attended the opening ceremony and officially unveiled the golden lion mascot.
Leaders from industry leaders such as TSMC, Intel, and NVIDIA gathered to engage in in-depth discussions on key semiconductor development trends—including data centers, high-performance computing, 5G, AI, and IoT. The conversation placed a strong focus on advanced packaging technologies like 2.5D/Panel Fanout and SiP, with a detailed exploration of current advancements and future directions in packaging techniques such as die (RDL)-first/last approaches, as well as TSV and Fanout interposers.
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Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
