Xiamen Tongfu Packaging and Testing Project Secures Funding Support from the China Development Bank
Release date:
2018-09-10
Recently, at the signing ceremony held during the 20th China International Investment & Trade Fair in Xiamen, Fujian Province, Xiamen Tongfu Microelectronics Co., Ltd. signed an investment cooperation agreement with the China Development Bank for the advanced integrated circuit packaging and testing base project.
Recently, at the signing ceremony held during the 20th China International Investment & Trade Fair in Xiamen, Fujian Province, Xiamen Tongfu Microelectronics Co., Ltd. signed an investment cooperation agreement with the China Development Bank for the Integrated Circuit Advanced Packaging and Testing Base Project. Over the next three years, the China Development Bank will inject 1.2 billion yuan into the project, supporting the company in researching and developing cutting-edge packaging and testing technologies for the integrated circuit industry, as well as advancing their commercialization. This initiative aims to ensure that advanced packaging technologies for integrated circuits remain independently controllable.
Mr. Shi Lei, President of Tongfu Microelectronics Co., Ltd. and Director of Xiamen Tongfu Microelectronics Co., Ltd., stated that they will gather semiconductor talent, innovatively develop cutting-edge technologies, and make efficient use of the funds provided by the China Development Bank. Together, they aim to build a world-class, green benchmark integrated circuit packaging and testing facility—leading in technological sophistication,智能化程度 (intelligent automation), first-rate environmental protection, and superior energy efficiency—thus contributing to the growth of China's IC industry and supporting the socio-economic development of Xiamen and Haicang!
Recommended News
Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
