On September 7, the "2nd International Summit Forum on Integrated Circuit Testing and Test Technologies & Future Development," guided by the Integrated Circuit Industry Technology Innovation Strategic Alliance, was hosted by the Nantong Municipal People's Government and the Integrated Circuit Testing Instruments and Equipment Industry Technology Innovation Alliance, and organized by the Nantong Municipal Electronic Information Industry Alliance and Tongfu Microelectronics Co., Ltd. The event took place in Nantong.
On September 7, the "2nd International Summit Forum on Integrated Circuit Testing and Test Technologies & Future Development," guided by the Integrated Circuit Industry Technology Innovation Strategic Alliance, hosted by the Nantong Municipal People's Government and the Integrated Circuit Testing Instruments and Equipment Industry Technology Innovation Alliance, and organized by the Nantong Municipal Electronic Information Industry Alliance and Tongfu Microelectronics Co., Ltd., was held in Nantong.
Cao Jianlin, Chairman of the Integrated Circuit Industry Technology Innovation Strategic Alliance and former Deputy Minister of the Ministry of Science and Technology; Ye Tianchun, Chairman of the Integrated Circuit Testing Instruments and Equipment Industry Technology Innovation Alliance and Director of the Institute of Microelectronics, Chinese Academy of Sciences; Qiu Gang, Deputy Inspector of the Major Projects Division of the Ministry of Science and Technology and Deputy Director of the Implementation Management Office for Project 02; Ding Wenwu, President of China National Integrated Circuit Industry Investment Fund Co., Ltd.—along with other industry leaders, experts, and entrepreneur representatives—attended the meeting. Shi Lei, President of Tongfu Microelectronics, attended the event and delivered the keynote speech in the morning session. Zhao Wenbin, Vice Mayor of the Municipal Government, also attended and delivered a welcoming speech.
