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The Xiamen Tongfu Packaging and Testing Project is progressing smoothly.

Release date:

2018-08-17

The Xiamen Tongfu Microelectronics Co., Ltd. Advanced Integrated Circuit Packaging and Testing Industry Base Project is jointly invested in and constructed by Tongfu Microelectronics Co., Ltd. and Xiamen Semiconductor Investment Group Co., Ltd.

The first-phase project of Xiamen Tongfu Integrated Circuit Packaging and Testing, one of Fujian Province's key construction initiatives, is progressing smoothly. By August 2018, the project’s registered capital had been fully contributed. Building on thorough preparatory work—including land consolidation, project approval procedures, and overall site layout design—the project has now completed the pile foundation work for the factory buildings and is currently advancing with the civil construction of the main plant. It is expected that factory construction will be finished in the first quarter of 2019, with production operations set to commence in the second quarter.

Dr. Zhang Yongzheng, Chief Intelligence Officer (CIO) of Tongfu Group and General Manager of Xiamen Tongfu, stated that Xiamen Tongfu Microelectronics Co., Ltd. will actively join the booming development of Xiamen's integrated circuit industry, striving with determination to deliver first-class OSAT operational performance through intelligent manufacturing. The company aims to become customers' preferred partner for value-added services, building its projects into a world-class green benchmark integrated circuit packaging and testing facility—boasting the highest technological standards, cutting-edge智能化 capabilities, and leading-edge environmental and energy-saving practices. In doing so, Xiamen Tongfu will contribute significantly to the growth of China's integrated circuit industry as well as to the socio-economic development of Xiamen and Haicang!

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