President Shi Lei attends the centralized signing, groundbreaking, and opening ceremony for major projects in Suzhou Industrial Park.
Release date:
2018-08-13
On August 10, Suzhou Industrial Park held a centralized ceremony marking the signing, groundbreaking, and opening of key projects under the theme "Reform Sets Sail Again, Opening Up Takes New Steps, and Development Achieves High Quality."
On August 10, Suzhou Industrial Park held a grand ceremony marking the centralized signing, groundbreaking, and opening of key projects themed "Reform Sets Sail Again, Opening Up Takes New Steps, and Development Achieves High Quality." Shi Lei, President of Tongfu Microelectronics and Chairman of Suzhou Tongfu Supermicro, attended the event and signed agreements. Also present were Loh Teck Wee, Consul General of Singapore in Shanghai, and Li Yaoping, Deputy Secretary of Suzhou Municipal Party Committee and Mayor, among other dignitaries.
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Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
