Tongfu Microelectronics and Loongson Science & Technology Forge Strategic Partnership


Release date:

2018-05-15

On the evening of May 14, the company issued an announcement stating that Tongfu Microelectronics and Loongson Science & Technology Co., Ltd. plan to engage in strategic cooperation across areas such as chip design, bump manufacturing, CPU product packaging, and testing, forming a mutually beneficial strategic alliance aimed at win-win collaboration.
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