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Tongfu Microelectronics' acquisition of AMD's packaging and testing assets has been awarded the "New Fortune" Best Overseas Project.

Release date:

2018-03-20

On March 19, *New Fortune Magazine* released the 11th edition of its list of China's Best Investment Banks, with Tongfu Microelectronics' acquisition of AMD's packaging and testing assets recognized as one of the Top 10 Best Overseas Projects.

On March 19, *New Fortune Magazine* released the 11th edition of its list ranking China's Best Investment Banks, with Tongfu Microelectronics' acquisition of AMD's packaging and testing assets recognized as one of the Top 10 Best Overseas Projects.
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