Nantong Tongfu Microelectronics Co., Ltd. Holds Groundbreaking Ceremony for Its Phase II Project
Release date:
2017-11-19
On the morning of November 18, Nantong Tongfu Microelectronics Co., Ltd., a holding subsidiary of the company, held the groundbreaking and commencement ceremony for its Phase II project. Ding Wenwu, President of China Integrated Circuit Industry Investment Fund Co., Ltd.; Professor Zhang Wei, expert from the "02" Special Project Overall Group and Vice Dean of Fudan University's School of Microelectronics; Qiang Qiang, Secretary of the Party Working Committee of Nantong Economic & Technological Development Zone; Wang Shaoyong, Director of the Management Committee of Sutong Science & Technology Industrial Park; Shi Mingda, Chairman of Tongfu Microelectronics; Shi Lei, President of the company; along with representatives from the Sutong Park and the company itself, attended the ceremony.
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Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
