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Staying true to our original aspiration, striving together for a brilliant future—Tongfu Microelectronics hosts an Integrated Circuit Development Summit Forum to celebrate its 20th anniversary.

Release date:

2017-10-21

As the nation enthusiastically celebrated the successful convening of the 19th National Congress of the Communist Party of China, Tongfu Microelectronics marked the company's 20th anniversary with a grand celebration.

As the nation enthusiastically celebrates the successful convening of the 19th National Congress of the Communist Party of China, Tongfu Microelectronics marked its 20th anniversary with a special event. On October 20, Tongfu Microelectronics chose to commemorate the occasion by hosting a flagship forum on integrated circuit development. At the same time, the company showcased its vibrant corporate culture, reflecting on the remarkable milestones achieved over the past two decades as it steadily advanced toward becoming a world-class leader in integrated circuit packaging and testing.

At the Integrated Circuit Industry Development Summit Forum held that day, industry leaders gathered from across the board. Lu Zhipeng, Secretary of Nantong Municipal Party Committee, sent a congratulatory letter to express his best wishes. Han Liming, Deputy Secretary of the Nantong Municipal Party Committee and Mayor of Nantong, Gong Huaijin, Deputy Director of Jiangsu Provincial Commission of Economy and Information Technology, and Cao Jianlin, Chairman of the Integrated Circuit Industry Technology Innovation Strategic Alliance and former Vice Minister of the Ministry of Science and Technology, also attended and delivered speeches. Invited guests included Ding Wenwu, General Manager of the National Integrated Circuit Industry Investment Fund; Ye Tianchun, Chief Engineer of the National Major Project 02; Xu Xiaotian, Executive Vice Chairman of the China Semiconductor Industry Association; and Yu Xiekang, Vice Chairman and Secretary-General of the Jiangsu Provincial Semiconductor Industry Association. The summit forum was chaired by Gao Feng, Deputy General Manager of Tongfu Microelectronics.

For the past 20 years, Tongfu Microelectronics has grown through both organic expansion and strategic acquisitions, becoming a leading multinational semiconductor group company and the "industry leader" in China's integrated circuit packaging and testing sector. Headquartered in Chongchuan District, Nantong, the company operates six major production facilities: its headquarters factory, Nantong Tongfu, Hefei Tongfu, Suzhou Tongfu Supermicro, Malaysia Tongfu Supermicro (Penang), and the under-construction Xiamen Tongfu. The group employs over 10,000 people and boasts total assets exceeding 11 billion yuan.

Shi Lei, President of Tongfu Microelectronics, introduced that Tongfu Microelectronics has seized the opportunities in integrated circuit development. During its first decade, the company grew into one of China's top ten integrated circuit packaging and testing enterprises and successfully went public on the stock market. In its second decade, Tongfu Microelectronics was recognized among China's Top 100 Electronic Information Enterprises and ranked seventh globally among the world's top 10 IC packaging and testing firms, securing a prominent position in the global integrated circuit industry chain. Now entering a new phase of growth, the company remains committed to realizing its "Tongfu Dream" and aims to become one of the world's top five players in the industry. Moving forward, Tongfu Microelectronics will continue to play a leading role in the electronic information sector.

In his keynote speech, Ding Wenwu pointed out that the current integrated circuit market is performing well, with strong growth momentum across all three key sectors, and Tongfu Microelectronics has already made its own significant contributions. Meanwhile, the industry fund is doing its utmost to support enterprise development, striving to build a secure, reliable industrial system and ecosystem while aiming to elevate the packaging and testing sector to an internationally leading level. Ye Tianchun also emphasized that information technology is an essential path for societal progress—something we must seize firmly to achieve transformative leaps forward. He further urged the industry to prioritize innovation, focusing on both vertical integration and collaborative, cross-sectoral development. Xu Xiaotian noted that the prosperity of the industry hinges on the thriving vitality of individual enterprises; however, when compared to cutting-edge international standards, there remains a noticeable gap, underscoring the need for even greater dedication and effort. Lastly, he assured that industry associations will continue to serve both government and businesses as steadfastly as ever, faithfully fulfilling their critical role in driving industrial advancement.

Dong Yunting, Director of the Strategic Research Center at China Academy of Information and Communications Technology, delivered a keynote speech, encouraging Tongfu Microelectronics to seize the commanding heights in the global high-tech national competitiveness. He emphasized leveraging application outcomes to drive industrial upgrades, build core competitive advantages within the global supply chain, and continuously provide critical technological and industrial support to China's manufacturing sector.

Looking back at the development history of Tongfu Microelectronics, the company's overall business performance has grown at an annual average rate of 20%. Total assets have surged from 91.36 million yuan at the time of its establishment to over 11 billion yuan today—an impressive 113.3-fold increase. Meanwhile, sales revenue has soared by 37.1 times, and total profits have climbed by 21.5 times. Starting as a small enterprise that initially rented factory space, Tongfu Microelectronics has steadily expanded its business footprint over the years. Building on the success of its thriving Chongchuan headquarters plant, the company has since established the Sutong and Hefei factories, acquired two advanced packaging and testing facilities previously owned by U.S.-based AMD—in Suzhou, China, and Penang, Malaysia—and is currently advancing construction of its new Xiamen facility. From its humble beginnings with just one factory, Tongfu Microelectronics has evolved into a robust, globally integrated group spanning multiple regions, cities, provinces, and even countries. The company remains committed to pursuing its vision of specialization and technological innovation, steadily moving toward a future of greater efficiency and competitiveness on the global stage.

The core competitive advantage driving enterprise development stems from its ability to innovate with technology that targets the world’s cutting-edge advancements. The company boasts high-level innovation platforms, including a nationally recognized Enterprise Technology Center, a national-level Postdoctoral Research Station, the Jiangsu Provincial Academician Workstation for Enterprises, and the Jiangsu Provincial Engineering Technology Research Center for New Integrated Circuit Packaging and Testing. Additionally, the company has established close collaborative relationships with renowned research institutions and universities such as the Institute of Microelectronics and the Institute of Microsystems of the Chinese Academy of Sciences, Tsinghua University, Peking University, and Huazhong University of Science and Technology. By undertaking and implementing China’s National Key Science and Technology Projects (Project 02), the company has significantly boosted its technological innovation capabilities, achieving several domestic firsts, including the full 12-inch 28-nanometer process. This has enabled a remarkable transformation in product offerings—from traditional packaging to advanced packaging solutions tailored for cloud-to-edge applications in today’s intelligent era. Meanwhile, the company has strengthened its intellectual property protection efforts, holding over 350 valid patents, and has been recognized as a National Intellectual Property Advantage Enterprise.

In 2016, Tongfu Microelectronics Group achieved sales revenue (including chips) of 20.2 billion yuan. Among them, the Chongchuan headquarters generated sales revenue (including chips) totaling 6.6 billion yuan, representing a year-on-year growth of 35.6%. In the first six months of 2017, Tongfu Microelectronics Group recorded operating revenue (including chips) of 13 billion yuan, with the Chongchuan headquarters contributing 3.86 billion yuan in sales (including chips), an impressive increase of 43.5% compared to the same period last year.

While rapidly advancing, Tongfu Microelectronics consistently upholds its social responsibility, adhering to the principles of energy conservation, emission reduction, low-carbon practices, and sustainable development. The company meticulously controls pollution and energy consumption throughout every stage of production. It has fully mastered green packaging technologies, achieving a 100% lead-free packaging rate. For thirteen consecutive years, the company has been recognized as a provincial or municipal "Green Enterprise," earning accolades such as "Provincial Environmentally Friendly Enterprise" and "Provincial Advanced Unit for Energy Conservation." Never forgetting its commitment to giving back to society, Tongfu Microelectronics has donated over 6 million yuan in total to charitable organizations and schools in Nantong City since the beginning of its second decade. At the subsequent corporate culture showcase event, Shi Mingda, Chairman of Tongfu Microelectronics, announced that the company will contribute 200,000 yuan to support 200 underprivileged students at two schools in Yili, Xinjiang.

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