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Signing Ceremony of the Strategic Cooperation Agreement between Tongfu Microelectronics and the People's Government of Haicang District, Xiamen City

Release date:

2017-06-26

On the afternoon of June 26, 2017, Tongfu Microelectronics Co., Ltd. (hereinafter referred to as "Tongfu Microelectronics") signed a strategic cooperation agreement with the People's Government of Haicang District, Xiamen City, in Xiamen, to jointly build an advanced integrated circuit packaging and testing production line (hereinafter referred to as the "Project").

On the afternoon of June 26, 2017, Tongfu Microelectronics Co., Ltd. (hereinafter referred to as "Tongfu Microelectronic") signed a strategic cooperation agreement with the People's Government of Haicang District, Xiamen City, in Xiamen, to jointly build an advanced integrated circuit packaging and testing production line (hereinafter referred to as the "Project"). According to the agreement, the total investment for the Project will be 7 billion yuan, with plans to establish an industrialized base focusing on cutting-edge packaging and testing technologies, including bumping, WLCSP, CP, FC, SiP, and compound materials from Groups III and V. The project is specifically designed to serve regional markets and key enterprises in the "Fuzhou-Xiamen-Zhangzhou-Quanzhou" area as well as South China, and it will be implemented in three phases.

Lin Wensheng, Member of the Standing Committee of Xiamen Municipal Party Committee, Secretary of the Party Working Committee and District Party Secretary of Haicang Taiwan-Invested Zone; Meng Qian, Vice Mayor, Director of the Management Committee, and District Mayor of Haicang Taiwan-Invested Zone; Li Huiyue, Vice Mayor; along with leaders from relevant departments and state-owned enterprises, attended the signing ceremony. Shi Mingda, Chairman of Tongfu Microelectronics, and Shi Lei, General Manager, joined the event alongside other senior company executives. Industry insiders such as Lao Yao, founder of Jiwei.com, as well as media representatives from provincial, municipal, and district levels, also graced the occasion. The signing of the cooperation agreement marks another major integrated circuit project poised to take root in Xiamen—and it represents Haicang's very first significant IC project. The successful implementation of this project will play a crucial role in strengthening Xiamen's integrated circuit industry chain, seamlessly connecting and fostering the "Shenzhen-Xiamen-Quanzhou-Zhangzhou-Fuzhou" regional industrial ecosystem.

Tongfu Microelectronics is ranked eighth globally and among the top three semiconductor packaging and testing companies in China. In 2016, the company achieved an output value of 20.2 billion yuan, becoming the first domestic packaging and testing enterprise to successfully scale up mass production across the entire process flow for the back-end operations of 12-inch 28-nanometer mobile phone processors. After years of rapid growth, with robust support from the National Key Science and Technology Project 02 and the National Integrated Circuit Industry Investment Fund, Tongfu Microelectronics has now mastered cutting-edge packaging and testing technologies, placing its overall technical capabilities on par with international industry leaders. Following the acquisition of AMD’s packaging and testing business in 2016, Tongfu Microelectronics has actively pursued global business expansion and R&D initiatives, steadily integrating into the supply chain systems of leading domestic and international clients—including MediaTek, Huawei (HiSilicon), ZTE, Unisoc, and UniSOC. Today, Tongfu Microelectronics operates five state-of-the-art packaging and testing facilities located in Nantong, Suzhou, Hefei, and Penang, Malaysia. The recently announced joint investment project between Tongfu Microelectronics and Xiamen Semiconductor Investment Group to build an advanced packaging and testing industrialization base marks Tongfu Microelectronics’ sixth such facility—and also represents the first-of-its-kind advanced packaging and testing hub along China’s southeastern coast. This groundbreaking initiative will help fill critical gaps in the integrated circuit packaging and testing ecosystem across the Xiamen-Zhangzhou-Quanzhou-Fuzhou region and the broader southeastern coastal area, while fostering seamless connections between industrial and talent resources on both sides of the Taiwan Strait.

In 2016, the Xiamen Municipal Party Committee and Government unveiled a ten-year plan for the development of the integrated circuit industry, aiming to propel the sector's scale beyond 100 billion yuan by 2025—and to leverage this growth into an even larger electronic information technology industry worth over 300 billion yuan. In response to its own needs for industrial transformation and upgrading, Haicang District has strategically positioned the integrated circuit industry as its flagship, guiding its development through a city-wide, coordinated approach that emphasizes differentiated planning and complementary growth. The district is prioritizing key areas such as integrated circuit packaging & testing, design, and wafer manufacturing oriented toward end products. To support this vision, Haicang recently released the "Implementation Plan for Xiamen Integrated Circuit Industry Development in Haicang District," along with配套 supporting policies aimed at boosting the industry and attracting top talent.

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