The company-led "Advanced Packaging Process Development and Industrialization Project," a key initiative under the National Key R&D Program 02, has successfully passed formal acceptance.
Release date:
2017-06-08
On June 7, 2017, the national key science and technology project "Advanced Packaging Process Development and Industrialization Project," led by Tongfu Microelectronics, successfully passed the formal acceptance inspection organized by the Office of Special Project 02.
On June 7, 2017, the national key science and technology project "Advanced Packaging Process Development and Industrialization," led by Tongfu Microelectronics, successfully passed the formal acceptance inspection organized by the Office of Project 02.
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Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
