Tongfu Microelectronics Makes a Spectacular Appearance at SEMICON CHINA 2017
Release date:
2017-03-21
From March 15 to 17, 2017, the International Semiconductor Equipment, Materials, Manufacturing, and Services Exhibition & Conference (SEMICONChina 2017) was held at the Shanghai New International Expo Center.
From March 15 to 17, 2017, the International Semiconductor Equipment, Materials, Manufacturing, and Services Exhibition & Conference (SEMICON China 2017) was held at the Shanghai New International Expo Center. Tongfu Microelectronics showcased its cutting-edge packaging products and technological achievements—gained in recent years through applications such as "cloud computing, network infrastructure, and smart terminals"—highlighting the company's presence at this year's event.
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Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004