Tongfu Microelectronics Makes a Spectacular Appearance at SEMICON CHINA 2017


Release date:

2017-03-21

From March 15 to 17, 2017, the International Semiconductor Equipment, Materials, Manufacturing, and Services Exhibition & Conference (SEMICONChina 2017) was held at the Shanghai New International Expo Center.

From March 15 to 17, 2017, the International Semiconductor Equipment, Materials, Manufacturing, and Services Exhibition & Conference (SEMICON China 2017) was held at the Shanghai New International Expo Center. Tongfu Microelectronics showcased its cutting-edge packaging products and technological achievements—gained in recent years through applications such as "cloud computing, network infrastructure, and smart terminals"—highlighting the company's presence at this year's event.

Return to list →