Our company's two technological upgrade projects have successfully passed the acceptance inspection.
Release date:
2016-10-30
On the afternoon of October 29, the Chongchuan District Commission of Economy and Information Technology organized an expert panel to conduct the completion acceptance of our company's two technological renovation projects: the "Stamping Double-Row Flat No-Lead (PDFN) Packaging and Testing Production Line" and the "Expansion of Advanced Packaging Facilities for BGA, QFN, and Other Technologies, as well as Small-Form-Factor (SOP) Packaging Production."
On the afternoon of October 29, the Chongchuan District Commission of Economy and Information Technology organized an expert panel to conduct the completion acceptance of our company's two technological renovation projects: the "Stamping Double-Row Flat No-Lead (PDFN) Packaging and Testing Production Line" and the "Expansion of Advanced Packaging Facilities such as BGA and QFN, along with Small-Outline Package (SOP) Production Capacity." The expert panel concluded that both projects have successfully fulfilled their investment plans and are expected to deliver the anticipated benefits upon full operation. The smooth completion and successful acceptance of these two projects are of significant importance for the company in maintaining steady growth and accelerating its transformation.
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Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
