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Hefei Tongfu Microelectronics Co., Ltd. Holds Inauguration Ceremony

Release date:

2016-08-12

On August 11, the unveiling ceremony for Hefei Tongfu Microelectronics Co., Ltd. was held at the project site in Hefei Economic Development Zone. Sun Yuzhou, Deputy Director of the Development Zone Management Committee, along with Shi Lei, General Manager of Tongfu Microelectronics (the investor), and representatives from the construction company, attended the event.

On August 11, the unveiling ceremony for Hefei Tongfu Microelectronics Co., Ltd. was held at the project site in Hefei Economic Development Zone. Sun Yuzhou, Deputy Director of the Economic Development Zone Management Committee, along with Shi Lei, General Manager of Tongfu Microelectronics (the investor), and representatives from the construction company, attended the event.

In his speech, Tongfu Microelectronics General Manager Shi Lei pointed out that the unveiling of Tongfu Microelectronics' Hefei facility marks the completion of the company's Hefei factory. Currently, the integrated circuit industry has become a national strategic priority, with increasingly robust policy support driving industry growth. As a result, the sector’s innovation capabilities and competitive edge have significantly improved. Against this favorable market and policy backdrop, Tongfu Microelectronics continues to accelerate its pace of development. The construction of the new Hefei plant represents a crucial and pivotal step for the company as it strives "to leverage its industrialization base projects and build a world-class packaging and testing enterprise." With the inauguration of the Hefei facility, Tongfu Microelectronics has now grown into an international group with five state-of-the-art manufacturing plants.

In his speech, Deputy Director Sun Yuzhou of the Economic Development Zone Management Committee pointed out that Hefei Tongfu Microelectronics Co., Ltd. is a key production base for integrated circuit packaging and testing in Hefei City, serving as an essential link in the city’s efforts to build itself into an "IC Capital." He expressed hope that the company would meticulously prepare for mass production, maintaining its momentum and continuing to strive forward, so as to swiftly achieve its targeted production scale and profitability. Furthermore, he emphasized the vision of transforming Hefei’s new factory into a world-class, green benchmark facility—leading not only in comprehensive process technology and cutting-edge technical expertise but also in advanced automation—and setting new standards for top-tier environmental protection and energy efficiency, ultimately contributing significantly to Hefei’s robust and sustainable economic and social development.

The unveiling ceremony was hosted by Hu Wenlong, Deputy General Manager of Tongfu Microelectronics. Attendees included Wu Wenli, Director of Investment Promotion at Hefei Economic Development Zone; Fu Haibin, Deputy Director of the Bureau of Economic and Trade Development; Zhou Zhonghua, Deputy Secretary of the Xingang Industrial Park; Li Yicong, Chief Operating Officer of Tongfu Microelectronics; Zhang Dong, Chairman of the Supervisory Board; Zhao Yajun, Director of Operations; Wu Pinzhong, Deputy Chief Engineer; Ji Jia'an, Technical Deputy Director of the First Business Division; Zhang Songhe, Head of the Testing Department at the First Business Division; Zhong Tingting, Deputy Director of the Sales Department; and representatives from the project construction unit.

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