The 14th China Semiconductor Packaging and Testing Technology & Market Annual Conference Held in Nantong
Release date:
2016-06-16
On June 15, the "14th China Semiconductor Packaging and Testing Technology & Market Annual Conference" for 2016 was grandly held in Nantong.
On June 15, the highly anticipated "14th China Semiconductor Packaging and Testing Technology & Market Annual Conference" for 2016 was grandly held in Nantong. This year's conference brought together industry elites and reached an unprecedented scale, making it the largest and most well-attended event in the history of the conference series.
The meeting began with Shi Mingda, Rotating Chairman of the Packaging Branch of the China Semiconductor Industry Association and Chairman of Tongfu Microelectronics, extending a warm welcome on behalf of the conference organizing committee and Tongfu Microelectronics to the distinguished guests and industry peers in attendance. During the session, Chairman Shi delivered a report titled "Current Status and Future Prospects of China's Semiconductor Packaging Industry." Meanwhile, General Manager Shi Lei shared insights into Tongfu Microelectronics' innovative development initiatives at the meeting.
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Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
