The "R&D and Industrialization of High-Integration, Multi-Functional Chip System-Level Packaging Technology," led by Tongfu Microelectronics, has officially passed the task and financial acceptance reviews.
Release date:
2016-05-28
On May 27, 2016, the Implementation Management Office of the National Key Science and Technology Project "Manufacturing Equipment and Complete Processes for Ultra-Large-Scale Integrated Circuits" (hereafter referred to as the "02" Key Project) jointly convened an acceptance expert panel together with the overall expert group.
On May 27, 2016, the Implementation Management Office of the National Key Science and Technology Project "Manufacturing Equipment and Complete Processes for Ultra-Large-Scale Integrated Circuits" (hereafter referred to as the "02" Major Project), together with the Overall Expert Group, convened an acceptance expert panel in Nantong. The panel officially held the acceptance meeting for the project titled "Research and Industrialization of High-Integration Multi-Functional Chip System-Level Packaging Technology," led by Nantong Fujitsu Microelectronics Co., Ltd. (Project No.: 2011ZX02601).
The task acceptance expert panel listened to the project implementing organization's report on the project's completion status, reviewed the testing and documentation review reports from the on-site testing team, as well as user feedback reports, and examined the relevant acceptance documents. Meanwhile, the financial acceptance expert panel, based on the "Provisional Measures for the Management of Major Science and Technology Special Funds for Civilian Use," the "Financial Acceptance Measures for Major Science and Technology Projects for Civilian Use," the "Supplementary Notice from the Ministry of Finance Regarding Regulations on Budget Adjustments for Major Science and Technology Projects (Topics) for Civilian Use," and other pertinent financial guidelines, compared the project budget with related approval documents. They also reviewed the project audit report, conducted spot checks of general ledgers, detailed accounts, original vouchers, material lists, budget adjustment application reports, and approval letters, and performed on-site verification. After thorough inquiries and discussions, the acceptance expert panel unanimously agreed that the project has successfully passed both the task and financial formal acceptance processes.
Recommended News
Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
