Tongfu Microelectronics and AMD Announce Strategic Partnership, Launching High-End Processor Chip Packaging and Testing Facility in Suzhou


Release date:

2016-05-04

On May 3, 2016, Tongfu Microelectronics and AMD held the launch ceremony for their strategic partnership and the high-end processor chip packaging and testing base in Suzhou.

On May 3, 2016, Tongfu Microelectronics and AMD held a strategic cooperation ceremony and officially launched the high-end processor chip packaging and testing base in Suzhou.
Previously, on April 29, Tongfu Microelectronics announced that it had completed the acquisition of 85% equity stakes in both AMD Suzhou and AMD Penang, investing a total of US$371 million. As the controlling shareholder, Tongfu Microelectronics successfully established an integrated circuit packaging and testing joint venture company alongside AMD. The new joint venture is planned to be named Tongfu Supermicro, with the trademark TF-AMD. This marks the beginning of a strategic collaboration between Tongfu Microelectronics and AMD, backed by the National Integrated Circuit Industry Fund, and also signifies the official launch of a state-of-the-art processor chip packaging and testing facility.
This time, Tongfu Microelectronics has successfully formed a strong partnership with AMD to establish a high-end processor chip packaging and testing collaboration platform. This achievement is made possible thanks to the consistent support and assistance provided by the nation's major national science and technology projects, which have helped the company bring its chip packaging technology close to the international advanced level—and ultimately positioned it as a partner for global multinational corporations.
Tongfu Microelectronics' recent acquisition has received strong support from the National Integrated Circuit Industry Investment Fund, a major investment vehicle. This strategic partnership not only represents Tongfu Microelectronics' deliberate expansion plan but also embodies the nation's strategy and determination.
Return to list →