The mid-term review meeting for the provincial science and technology achievement transformation project was held at our company.
Release date:
2016-04-01
On March 31, the mid-term review meeting for our company's 2015 Jiangsu Provincial Science and Technology Achievement Transformation Special Fund project—“R&D and Industrialization of System-Level Packaging Technology for a 28-nanometer Application Processor Chip in Mobile Smart Terminals”—was held in our company’s VIP Conference Hall. Ding Wanchun, Director of our company, reported to the attending leaders and experts on the project’s progress.
On March 31, the mid-term acceptance meeting for our company's 2015 Jiangsu Provincial Science and Technology Achievement Transformation Special Fund project—“R&D and Industrialization of System-Level Packaging Technology for a 28-nanometer Application Processor Chip in Mobile Smart Terminals”—was held in our company’s VIP Conference Hall. Ding Wanchun, Director of our company, reported to the attending leaders and experts on the project’s progress.
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Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
