The 28nm system-level packaging project has been designated as a provincial special fund project for the commercialization of scientific and technological achievements.
Release date:
2015-11-27
Recently, the project "R&D and Industrialization of System-Level Packaging Technology for 28nm Application Processor Chips in Mobile Smart Terminals," undertaken by Tongfu Microelectronics, was listed by the Jiangsu Provincial Department of Science and Technology as a special fund project for scientific and technological achievement transformation in Jiangsu Province.
Recently, the project "R&D and Industrialization of System-Level Packaging Technology for 28nm Application Processor Chips in Mobile Smart Terminals," undertaken by Tongfu Microelectronics, has been designated as a Jiangsu Provincial Science and Technology Achievement Transformation Special Fund Project by the Jiangsu Provincial Department of Science and Technology. The project has received an initial funding grant of 6 million yuan from the provincial science and technology authority.
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Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
